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SuperSpeed USB 3.0 spec officially released, first chipset demonstrated

By November 17, 2008No Comments

It’s been nearly a year since we first saw the USB 3.0 connector make an appearance at CES, and after months of corporate infightingspec-polishing, and technical navel-gazing, the future of consumer peripheral connectivity is here — in the form of complete specifications and a demo. Yeah, so maybe SuperSpeed USB isn’t making the most dramatic entrance ever, but hey, it doesn’t have to with 4.8Gbps transfer speeds, improved power management, and backwards compatibility with USB 2.0 along for the ride. As expected, the first wave of devices won’t hit until 2010, but Symwave’s giving attendees of this week’s SuperSpeed conference a taste of tomorrow with a demo of the Quasar USB 3.0 chipset, which is targeted at “sync-and-go” devices like phones and media players. 

Read – SuperSpeed USB 3.0 spec released
Read – Symwave demos first USB 3.0 physical layer device


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Josh Lam

Hi my name is Josh Lam and I'm from the city-state of Hong Kong. Realizing there was more to explore than this city, my goal is to visit all 193 countries in the world by using a combination of credit card points and airline miles to travel better for less.

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